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Faraday Cup 法拉第杯

Faraday Cup

CAMECA 法拉第杯用于测量粒子源产生的离子束或电子束电流。通过真空环境下可移动的结构以及与电子控制单元相连的柔性连接方式,它能够提供更高的灵活性,以适应不同应用需求。

离子源模块配置包括:
  • 1 个 BNC 测量接口,可兼容 TES 离子源控制机架
  • 1 根供电电缆
可提供多种孔径配置,并支持定制尺寸:
  • 狭缝孔径:标准规格最长 19 mm、宽 5 mm
  • 圆孔孔径:直径 1 mm
  • 圆形孔径:直径最大可达 18.5 mm
法拉第杯的孔径尺寸可根据您的具体应用需求进行定制。
  • 规格参数 +


    法拉第杯 机械特性
    真空馈通法兰类型 单接口 CF40
    真空环境下可移动 是,通过柔性电缆与电子单元连接
    孔径范围 圆形孔径:最大 18.5 mm
    狭缝孔径:标准规格最长 19 mm、宽 5 mm
    可根据需求定制
    屏蔽罩直径 32 mm
    总长度 法拉第杯(真空内):80.5 mm
    电子单元:100.8 mm(含 BNC 连接器)
    法拉第杯 推荐使用参数
    束流功率等级 最高 20 W
    测量精度 最大校准电流的 0.1%
    校准电流范围 可调范围:0–100 nA 至 0–100 mA
    交流输入电压 230 V
    偏置电压 最高 200 V
    束流极性(正极或负极) 均支持
    电气连接 1 个 BNC 测量接口(随设备提供),兼容 TES 离子源控制机架
    1 根电源线(随设备提供)
    冷却方式 无需冷却
  • 产品应用 +

    • Ion beam sputter deposition system applying a focused ion beam to a target material, facilitating thin film coating on a substrate
      Ion beam sputter deposition

      Ion Beam Sputter Deposition (IBSD) is a physical vapor deposition (PVD) technique that consists in adding a thin film to the substrate surface to improve its material properties. Traditional challenges of IBSD such as high maintenance, high level of complexity, and difficulty to scale up are overcome thanks to CAMECA’s unique ECR technology.

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    • Ion implantation apparatus directing high-energy ions into a semiconductor wafer to modify its electrical properties.
      Ion beam figuring (IBF)

      Ion Beam Figuring consists in locally sputtering atoms in order to create a surface with a specified profile. It is a used for precise figuring and finishing of optical elements, such as spheres, aspheres and free forms on lenses and mirrors. CAMECA’s ECR technology and ion optics system offer the highest flexibility in beam size, shape, and energy.

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    • Ion implantation apparatus directing high-energy ions into a semiconductor wafer to modify its electrical properties.
      Ion implantation

      Ion implantation consists in adding ions to the interior of a substrate to change its elemental composition and improve material properties. It is commonly used for steel toughening, medical implants, and semiconductor device fabrication.

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    • Ion beam system performing etching and polishing processes on a material surface to achieve desired microstructures.
      Etching, cleaning, polishing & milling

      Sputter cleaning, ion polishing, milling and cutting are all based on Ion Beam Sputtering. They are used as a surface preparation step before depositing a thin film, before high resolution imaging or surface analysis as well as for nanostructuring a surface. CAMECA’s ECR technology delivers stable and reliable beams, eliminating the maintenance required with filament-based technologies.

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    • Ion assisted deposition setup enhancing thin film growth by bombarding the substrate with low-energy ions during deposition.
      Ion assisted deposition

      Ion Assisted Deposition consists in modifing the properties of a growing thin film by directing an ion beam at it. It can also be used to purposely introduce compressive stress in the film to improve its mechanical properties. The stability and reliability of CAMECA ECR technology is attractive for ion assistance applications.

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    • Advanced instrumentation used in nuclear and atomic physics research for analyzing atomic structures and reactions.
      Nuclear and atomic physics

      CAMECA high energy single cavity sources are used in various setups for nuclear and atomic physics, ranging from particle injection into electrostatic storage rings or charge boosters, to power testing of future neutron detectors.

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  • 文档下载 +

  • 科研文章 +


    以下是CAMECA ECR 离子/电子源用户发表的部分论文:

    Novel low-temperature and high-flux hydrogen plasma source for extreme-ultraviolet lithography applications. A. S. Stodolna, T. W. Mechielsen, P. van der Walle, C. Meekes, H. Lensen. Published Online: 6 August 2024. 阅读全文

    Ion source developments to supply mono & multi charged ion beams to the new NHa C400 hadrontherapy system. L. Maunoury, P. Velten, X. Donzel, V. Engelen, G. Collignon, P. Sortais, J. Perrussel, P. Paliard and D. Bérard. Citation L. Maunoury et al 2024 J. Phys.: Conf. Ser. 2743 012090. 阅读全文

    Development of a high current electron beam facility for compact accelerator neutron source target thermal tests. J.F. Muraz, D. Santos, V. Ghetta, J. Giraud, O. Guillaudin, P. Sortais, T. Thuillier, J. Marpaud, M. Chala, M. Forlino, M. Hervé. Volume 1062, May 2024, 169214.  阅读全文

    Controlling the optical properties of hafnium dioxide thin films deposited with electron cyclotron resonance ion beam deposition. Chalisa Gier, Marwa Ben Yaala, Callum Wiseman, Sean MacFoy, Martin Chicoine, François Schiettekatte, James Hough, Sheila Rowan, Iain Martin, Peter MacKay, Stuart Reid, Volume 771, 30 April 2023, 139781. 阅读全文

    Processing and characterization of a multibeam sputtered nanocrystalline CoCrFeNi high-entropy alloy film. P. Nagy, N. Rohbeck, G. Roussely, P. Sortais, J.L. Lábárb, J. Gubicza, J. Michler, L. Pethö. Received 16 July 2019, Revised 31 January 2020, Accepted 11 February 2020, Available online 11 February 2020, Version of Record 29 February 2020. 阅读全文

    Amorphous Silicon with Extremely Low Absorption: Beating Thermal Noise in Gravitational Astronomy. I. A. Birney, J. Steinlechner, Z. Tornasi, S. MacFoy, D. Vine, A. S. Bell3, D. Gibson, J. Hough, S. Rowan et al. P. Sortais, S. Sproules, S. Tait, I. W. Martin, and S. Reid1. Phys. Rev. Lett. 121, 191101 – Published 6 November, 2018.
    阅读全文

    Effect of elevated substrate temperature deposition on the mechanical losses in tantala thin film coatings.Classical and Quantum Gravity, 35, 075001. (doi:10.1088/1361-6382/aaad7c). Vajente, G., Birney, R., Ananyeva, A., Angelova, S., Asselin, R., Baloukas, B., Bassiri, R., Billingsley, G., Fejer, M.M., Gibson, D., Godbout, L.J., Gustafson, E., Heptonstall, A., Hough, J., MacFoy, S., Markosyan, A., Martin, I.W., Martinu, L., Murray, P.G., Penn, S., Roorda, S., Rowan, S., Schiettekatte, F., Shink, R., Torrie, C., Vine, D., Reid, S., and Adhikari, R.X.  08 February 2018. 阅读全文

  • 用户一览 +


    CAMECA 的 ECR 源客户遍布全球各大洲,其中超过 80% 来自半导体、分析仪器和医疗健康等工业领域。以下列举部分学术机构客户:
    • 长沙埃福思科技有限公司,中国长沙
    • 材料制备与结构研究中心(CEMES),法国图卢兹
    • 等离子体-表面相互作用化学实验室(ChIPS),蒙斯大学,比利时
    • 霍华德·休斯医学研究所(Howard Hughes Medical Institute),美国马里兰州
    • 劳厄-朗之万研究所(Institut Laue-Langevin),法国格勒诺布尔
    • 光与物质研究所(Institut Lumière Matière),法国里昂第一大学
    • 奥赛核物理研究所(Institut de Physique Nucléaire d’Orsay),法国
    • 奥赛分子科学研究所(Institut des Sciences Moléculaires d’Orsay),法国
    • 薄膜、传感器与成像研究所(Institute of Thin Films, Sensors and Imaging),英国西苏格兰大学
    • 亚原子物理与宇宙学实验室(CNRS/IN2P3),法国格勒诺布尔
    • 劳伦斯利弗莫尔国家实验室,美国加利福尼亚州
    • 马克斯·普朗克研究所(海德堡),德国
    • 荷兰应用科学研究组织(TNO),荷兰代尔夫特
    • 斯特拉斯克莱德大学,英国格拉斯哥
    • 塔塔基础研究所,印度海得拉巴
    • 埃因霍温理工大学材料力学多尺度实验室,荷兰
    • 米兰比可卡大学,意大利