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TES-63

TES-63

基于 CF63 法兰的紧凑型 ECR 离子源,束流能量最高可达 15 kV

TES-63 基于安装于 ConFlat CF63 法兰上的 TES 谐振腔设计,束流能量最高可达 15 kV。

TES-63 提供三种版本:

  • 宽束离子源版本适用于多种应用,包括溅射、离子束铣削、清洗和抛光。
  • 高亮度离子源版本既可采用标准配置,也可选配 Einzel 透镜,以提高束流亮度并调整束流形状。该版本非常适用于质谱分析、离子束铣削、刻蚀以及束线应用。
  • 电子源版本适用于需要最高 15 kV 电子束的多种应用,包括电子化学、表面清洗和缺陷修复。
  • TES-63 是唯一提供扫描器选项的 TES 系列型号,可实现束流的精确偏转并对目标表面进行扫描。借助波形发生器,束流轨迹既可以按照光栅扫描方式运动,也可以沿任意设定曲线运动。

增加双极模式选项后,离子源可交替产生离子和电子,从而通过单一设备满足多种应用需求。

  • 规格参数 +


    TES-63 电子源 离子源-宽束型 离子源-高亮度型 离子源-扫描型
    应用 电子化学(最低至 100 V)/ 高功率电子束(最高 1.5 kW) 束线应用、加速器、质谱分析、溅射 束线应用、加速器、质谱分析、刻蚀 刻蚀、修形
    能量范围 100 V – 15 kV 0.5 – 15 kV 0.5 – 15 kV 0.5 – 15 kV
    电流 0.1 至 50 mA 0.1 至 5 µA(典型值,配备 0.3 mm 提取电极)
    10 至 500 µA(典型值,配备 3 mm 提取电极)
    0.3 至 300 µA 10 至 500 µA
    束斑尺寸(典型值,距离 Einzel 透镜 10 cm 处) 取决于能量和聚焦条件 0.3–30 mm 0.5–5 mm 0.3–5 mm
    插入深度 150 mm 起,可按需提供更长尺寸 150 mm 起,可按需提供更长尺寸 300 mm(配备 Einzel 透镜) 360 mm(配备 Einzel 透镜和扫描器)
  • 产品应用 +

    • Ion beam sputter deposition system applying a focused ion beam to a target material, facilitating thin film coating on a substrate
      Ion beam sputter deposition

      Ion Beam Sputter Deposition (IBSD) is a physical vapor deposition (PVD) technique that consists in adding a thin film to the substrate surface to improve its material properties. Traditional challenges of IBSD such as high maintenance, high level of complexity, and difficulty to scale up are overcome thanks to CAMECA’s unique ECR technology.

      继续阅读

    • Ion implantation apparatus directing high-energy ions into a semiconductor wafer to modify its electrical properties.
      Ion beam figuring (IBF)

      Ion Beam Figuring consists in locally sputtering atoms in order to create a surface with a specified profile. It is a used for precise figuring and finishing of optical elements, such as spheres, aspheres and free forms on lenses and mirrors. CAMECA’s ECR technology and ion optics system offer the highest flexibility in beam size, shape, and energy.

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    • Ion implantation apparatus directing high-energy ions into a semiconductor wafer to modify its electrical properties.
      Ion implantation

      Ion implantation consists in adding ions to the interior of a substrate to change its elemental composition and improve material properties. It is commonly used for steel toughening, medical implants, and semiconductor device fabrication.

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    • Ion beam system performing etching and polishing processes on a material surface to achieve desired microstructures.
      Etching, cleaning, polishing & milling

      Sputter cleaning, ion polishing, milling and cutting are all based on Ion Beam Sputtering. They are used as a surface preparation step before depositing a thin film, before high resolution imaging or surface analysis as well as for nanostructuring a surface. CAMECA’s ECR technology delivers stable and reliable beams, eliminating the maintenance required with filament-based technologies.

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    • Ion assisted deposition setup enhancing thin film growth by bombarding the substrate with low-energy ions during deposition.
      Ion assisted deposition

      Ion Assisted Deposition consists in modifing the properties of a growing thin film by directing an ion beam at it. It can also be used to purposely introduce compressive stress in the film to improve its mechanical properties. The stability and reliability of CAMECA ECR technology is attractive for ion assistance applications.

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    • Advanced instrumentation used in nuclear and atomic physics research for analyzing atomic structures and reactions.
      Nuclear and atomic physics

      CAMECA high energy single cavity sources are used in various setups for nuclear and atomic physics, ranging from particle injection into electrostatic storage rings or charge boosters, to power testing of future neutron detectors.

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  • 文档下载 +

  • 科研文章 +


    以下是CAMECA ECR 离子/电子源用户发表的部分论文:

    Novel low-temperature and high-flux hydrogen plasma source for extreme-ultraviolet lithography applications. A. S. Stodolna, T. W. Mechielsen, P. van der Walle, C. Meekes, H. Lensen. Published Online: 6 August 2024. 阅读全文

    Ion source developments to supply mono & multi charged ion beams to the new NHa C400 hadrontherapy system. L. Maunoury, P. Velten, X. Donzel, V. Engelen, G. Collignon, P. Sortais, J. Perrussel, P. Paliard and D. Bérard. Citation L. Maunoury et al 2024 J. Phys.: Conf. Ser. 2743 012090. 阅读全文

    Development of a high current electron beam facility for compact accelerator neutron source target thermal tests. J.F. Muraz, D. Santos, V. Ghetta, J. Giraud, O. Guillaudin, P. Sortais, T. Thuillier, J. Marpaud, M. Chala, M. Forlino, M. Hervé. Volume 1062, May 2024, 169214.  阅读全文

    Controlling the optical properties of hafnium dioxide thin films deposited with electron cyclotron resonance ion beam deposition. Chalisa Gier, Marwa Ben Yaala, Callum Wiseman, Sean MacFoy, Martin Chicoine, François Schiettekatte, James Hough, Sheila Rowan, Iain Martin, Peter MacKay, Stuart Reid, Volume 771, 30 April 2023, 139781. 阅读全文

    Processing and characterization of a multibeam sputtered nanocrystalline CoCrFeNi high-entropy alloy film. P. Nagy, N. Rohbeck, G. Roussely, P. Sortais, J.L. Lábárb, J. Gubicza, J. Michler, L. Pethö. Received 16 July 2019, Revised 31 January 2020, Accepted 11 February 2020, Available online 11 February 2020, Version of Record 29 February 2020. 阅读全文

    Amorphous Silicon with Extremely Low Absorption: Beating Thermal Noise in Gravitational Astronomy. I. A. Birney, J. Steinlechner, Z. Tornasi, S. MacFoy, D. Vine, A. S. Bell3, D. Gibson, J. Hough, S. Rowan et al. P. Sortais, S. Sproules, S. Tait, I. W. Martin, and S. Reid1. Phys. Rev. Lett. 121, 191101 – Published 6 November, 2018.
    阅读全文

    Effect of elevated substrate temperature deposition on the mechanical losses in tantala thin film coatings.Classical and Quantum Gravity, 35, 075001. (doi:10.1088/1361-6382/aaad7c). Vajente, G., Birney, R., Ananyeva, A., Angelova, S., Asselin, R., Baloukas, B., Bassiri, R., Billingsley, G., Fejer, M.M., Gibson, D., Godbout, L.J., Gustafson, E., Heptonstall, A., Hough, J., MacFoy, S., Markosyan, A., Martin, I.W., Martinu, L., Murray, P.G., Penn, S., Roorda, S., Rowan, S., Schiettekatte, F., Shink, R., Torrie, C., Vine, D., Reid, S., and Adhikari, R.X.  08 February 2018. 阅读全文

  • 用户一览 +


    CAMECA 的 ECR 源客户遍布全球各大洲,其中超过 80% 来自半导体、分析仪器和医疗健康等工业领域。以下列举部分学术机构客户:
    • 长沙埃福思科技有限公司,中国长沙
    • 材料制备与结构研究中心(CEMES),法国图卢兹
    • 等离子体-表面相互作用化学实验室(ChIPS),蒙斯大学,比利时
    • 霍华德·休斯医学研究所(Howard Hughes Medical Institute),美国马里兰州
    • 劳厄-朗之万研究所(Institut Laue-Langevin),法国格勒诺布尔
    • 光与物质研究所(Institut Lumière Matière),法国里昂第一大学
    • 奥赛核物理研究所(Institut de Physique Nucléaire d’Orsay),法国
    • 奥赛分子科学研究所(Institut des Sciences Moléculaires d’Orsay),法国
    • 薄膜、传感器与成像研究所(Institute of Thin Films, Sensors and Imaging),英国西苏格兰大学
    • 亚原子物理与宇宙学实验室(CNRS/IN2P3),法国格勒诺布尔
    • 劳伦斯利弗莫尔国家实验室,美国加利福尼亚州
    • 马克斯·普朗克研究所(海德堡),德国
    • 荷兰应用科学研究组织(TNO),荷兰代尔夫特
    • 斯特拉斯克莱德大学,英国格拉斯哥
    • 塔塔基础研究所,印度海得拉巴
    • 埃因霍温理工大学材料力学多尺度实验室,荷兰
    • 米兰比可卡大学,意大利
  • 升级套件 +


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